skip to Main Content

ABOUT KIZI LAPPING

Kizi Lapping Machine Manufacturing Co., Ltd. was established in 2010, mainly research and development, production, manufacturing, sales of high precision plane grinding lapping and polishing machine and their matching consumables.

Our products are widely used in the grinding and polishing process of metal and non-metal (including ceramic,optical glass ,sapphire, Sealing ring, silicon carbide substrate, gallium nitride wafer, silicon wafer and other semiconductor materials)

More About

PRODUCT DISPLAY

High-precision plane polishing is to use free granular abrasives to move relatively on the workpiece surface and the base surface of the grinding disc, so that the workpiece surface can obtain a higher plane and smoothness.

Polishing Liquid
Used for precision polishing of metals and non-metals such as stainless steel, sapphire LED substrates, silicon wafers, ceramics, optical glass, etc.
Horizontal high speed thinning machine
It is used for high-speed thinning of brittle and hard materials such as silicon wafers, ceramics, glass, quartz crystals, sapphire, and other semiconductor materials.

NEWS DYNAMIC

The process of processing stainless steel by plane grinding and polishing machine

Stainless steel with its excellent corrosion resistance, good mechanical properties and surface grinding and polishing…

2018 Germany International Grinding Technology and Equipment Exhibition GrindTec

The 20th Lijia International Intelligent Equipment Exhibition 2019, May 23-26, 2019, opened in Chongqing International…

Several forms of double-sided grinding machine processing methods

Double-sided grinding machine processing method: 1.  Dry grinding: only a small amount of lubricant additive…

The 20th Lijia International Intelligent Equipment Exhibition 2019

The 20th Lijia International Intelligent Equipment Exhibition 2019, May 23-26, 2019, opened in Chongqing International…

Back To Top