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high-speed thinning machine-KJ360L

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This thinning machine is mainly used for high-speed thinning of non-metallic and metal precision parts.

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This thinning machine is mainly used for high speed thinning of non-metallic and metal precise parts of brittle and hard materials such as silicon wafer, ceramics, glass, quartz crystal, sapphire, other semiconductor materials.

Model Lap plate diameter(mm) Max. processing diameter(mm)
KJ200L Φ200 Φ200
KJ360L Φ312 Φ360

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