Horizontal high speed thinning machine
It is used for high-speed thinning of brittle and hard materials such as silicon wafers, ceramics, glass, quartz crystals, sapphire, and other semiconductor materials.
Video
Model | Lap plate diameter(mm) | Max. processing diameter(mm) |
KJ200L | Φ200 | Φ200 |
KJ360L | Φ312 | Φ360 |